Summary: Process engineering in a fast-paced environment. Establishing both process maturation and stability whilst simultaneously pushing the limits of what is possible in semiconductor packaging. Required Skills: Fabrication Process Research Engineer Responsibilities: Innovate processes for fabrication of novel devices and advanced packaging solutions for flexible/stretchable integration of electronic components, devices, and systems Design experiments for development, evaluation and yield enhancement of processes to develop Best Known Methods (BKMs) that will be leveraged for prototype development Partner and collaborate with researchers, hardware engineers, device and systems integration teams, and external partners to push development beyond state-of-the-art Design, execute, and oversee internal, external, and hybrid manufacturing integration workflows to mature, document, track process stability, and deliver research prototypes Contribute new technologies and methods innovation to close critical capability gaps Minimum Qualifications: B.S. or equivalent degree or comparable experience in field of Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Applied Physics, Aerospace Engineering, or related field 2+ years experience in process engineering focused on micro- or nanofabrication, MEMS, advanced packaging and/or related technologies to include, but not limited to, wet/dry etch, chemical vapor deposition (CVD), physical vapor deposition (PVD), electrochemical deposition (ECD), photolithography, metrology, back-end-of-line (BEOL), surface mount technology (SMT), laser machining, micro-molding and/or similar fabrication processes Demonstrated >2 successful outcomes in process development and fabrication in a development or production environment, including, but not limited to, optimization of a single process, utilization of test and characterization methods and instruments for validation, electrical schematic design, physical layouts, mechanical design, and/or related outcomes 2+ years of experience in development and/or use of high performance electronic materials Preferred Qualifications: Advanced degree in field of Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Applied Physics, Aerospace Engineering, or related field Experience using Electronic Design Automation (EDA) tools in design and subsequent fabrication of advanced packaging technologies including flexible printed circuits (FPC), printed circuit board (PCB) and/or redistribution layers (RDL), wafer-level packaging (WLP), system-in-package (SiP), flexible hybrid electronics (FHE) or similar technology Either depth of expertise in a specific fabrication technology area or experience in process integration that leverages a breadth of process experience from front-end to BEOL with a demonstrated record of leveraging expertise to build devices, circuits, and/or systems Working experience with metrology equipment and processes, to include but not limited to, scanning electron microscopy (SEM), focused ion beam (FIB) cross-section, ellipsometry/reflectometry, automated optical inspection (AOI), atomic force microscopy (AFM), confocal & optical microscopy/inspection, contact and non-contact profilometry, scanning acoustic microscopy (SAM), or similar techniques Practical experience in substrate bonding and debonding, hermetic sealing, MEMS packaging, compression molding, transfer molding, planarization, or similar technologies Public Compensation: $139,000/year to $200,000/year + bonus + equity + benefits Industry: Internet Equal Opportunity: Meta is proud to be an Equal Employment Opportunity and Affirmative Action employer. We do not discriminate based upon race, religion, color, national origin, sex (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender, gender identity, gender expression, transgender status, sexual stereotypes, age, status as a protected veteran, status as an individual with a disability, or other applicable legally protected characteristics. We also consider qualified applicants with criminal histories, consistent with applicable federal, state and local law. Meta participates in the E-Verify program in certain locations, as required by law. Please note that Meta may leverage artificial intelligence and machine learning technologies in connection with applications for employment. Meta is committed to providing reasonable accommodations for candidates with disabilities in our recruiting process. If you need any assistance or accommodations due to a disability, please let us know at [email protected] . #J-18808-Ljbffr Facebook
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